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              UL /IEC/ EN 60950 Test Probe Kits BND-TPK01

              Product Description:UL /IEC/ EN 60950 IEC61032 Test Probe KitsModel:BND-TPK01Product Details:The BND-TPK-01 contains the devices listed in the core of the UL / IEC / EN 60950 requirements. It includes the following:· IEC Jointed Finger Probe (w/ banana jack in handle) (BND-B)· 50mm Impact Test Ball (BND-G500R)
              Description

              Product Description:

              UL /IEC/ EN 60950 IEC61032 Test Probe Kits

              Model:BND-TPK01


              Product Details:

              The BND-TPK-01 contains the devices listed in the core of the UL / IEC / EN 60950 requirements. It includes the following:

              · IEC Jointed Finger Probe (w/ banana jack in handle) (BND-B)

              · 50mm Impact Test Ball (BND-G500R)

              · Test Pin Probe: short (BND-13)

              · Rigid Finger Probe (BND-11)

              · Ball Pressure Tester (BND-QY102)

              · Telecom Test Probe (BND-TB12)

              Meets Requirements for Testing Standard(s) including but not limited to:IEC 60950EN 60950UL 60950CSA 950


              Datasheets of BND-TPK01 test probe kit:


              test probe B 1.jpgIEC61032  IEC60950  IEC60335
              IEC60529  IEC60045  IEC60884
              IEC60745
              Knurled Finger Diameter:12mm
              Knurled Finger Length:80mm
              Baffle Plate Diameter:50mm
              Baffle Plate Length:100mm
              Baffle Thickness:20mm
              BND-G500R
              Test Sphere 500G with ring
               2.jpgIEC61032  IEC60529Diameter:50mm
              Weight:227g
              BND-13
              Short Test Pin
               3.jpgIEC60065
              IEC60335
              IEC61032
              The probe Diameter:Head 3mm Tail 4mm
              The probe Length:15mm
              Dam-board Diameter:25mm
              Dam-board Thickness:4mm
              BND-11
              Rigid Test Probe 11
               4.jpgIEC61032
              IEC60065
              IEC60335
              IEC60884
              Nodular Finger Length:80mm
              Nodular Finger Diameter:12mm
              Dam-board Diameter:50mm
              Dan-board Thickness:5mm
              BND-TB12
              12mm Telecom Test Probe
               5.jpgIEC60065 IEC60695 IEC60950Probe Diameter:12mm
              Probe Length:80mm
              Baffle Plate Diameter:50mm
              BND-QY102
              Ball Pressure Apparatus
               6.jpgIEC60695-10-2 IEC60884
              IEC60320 IEC60335
              IEC60598
              IEC60950
              Ball diameter:5MM
              Total test pressure:20N±0.2N
              Samples bearing Diameter:50mm,Length:100mm Solid stainless steel cylinder



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